W3300 is a water-based cleaning agent suitable for post welding cleaning of electronic assembly, components, and semiconductor devices. This product can effectively remove soldering flux and solder paste residues from semiconductor components, circuit board assemblies, and other components. W3300 is suitable for ultrasonic cleaning processes, combined with deionized water rinsing, to achieve excellent cleaning results. W3300 has good compatibility and can be compatible with materials used in electronic assembly, wafer protrusions, advanced packaging manufacturing processes, and cleaning processes.